Beijing Institute of Mathematical Sciences and Applications Beijing Institute of Mathematical Sciences and Applications

  • About
    • President
    • Governance
    • Partner Institutions
    • Visit
  • People
    • Management
    • Faculty
    • Postdocs
    • Visiting Scholars
    • Staff
  • Research
    • Research Groups
    • Courses
    • Seminars
  • Join Us
    • Faculty
    • Postdocs
    • Students
  • Events
    • Conferences
    • Workshops
    • Forum
  • Life @ BIMSA
    • Accommodation
    • Transportation
    • Facilities
    • Tour
  • News
    • News
    • Announcement
    • Downloads
About
President
Governance
Partner Institutions
Visit
People
Management
Faculty
Postdocs
Visiting Scholars
Staff
Research
Research Groups
Courses
Seminars
Join Us
Faculty
Postdocs
Students
Events
Conferences
Workshops
Forum
Life @ BIMSA
Accommodation
Transportation
Facilities
Tour
News
News
Announcement
Downloads
Qiuzhen College, Tsinghua University
Yau Mathematical Sciences Center, Tsinghua University (YMSC)
Tsinghua Sanya International  Mathematics Forum (TSIMF)
Shanghai Institute for Mathematics and  Interdisciplinary Sciences (SIMIS)
BIMSA > Geometry and Physics Seminar Interesting invariants and TQFTs from 3d-3d correspondence
Interesting invariants and TQFTs from 3d-3d correspondence
Organizers
Hamed Adami , Chi Ming Chang , Mohammad Yavartanoo
Speaker
Sergei Gukov
Time
Thursday, May 26, 2022 10:00 AM - 11:00 AM
Venue
1129B
Online
Zoom 849 963 1368 (YMSC)
Abstract
We review recent progress in 3d-3d correspondence, with a focus on new topological invariants and on interesting topological quantum field theories (TQFTs). In particular, we discuss how this line of development can help to bridge topology and quantum topology.
Beijing Institute of Mathematical Sciences and Applications
CONTACT

No. 544, Hefangkou Village Huaibei Town, Huairou District Beijing 101408

北京市怀柔区 河防口村544号
北京雁栖湖应用数学研究院 101408

Tel. 010-60661855
Email. administration@bimsa.cn

Copyright © Beijing Institute of Mathematical Sciences and Applications

京ICP备2022029550号-1

京公网安备11011602001060 京公网安备11011602001060